PWB Assembly Soldering Process Guideline for Electronic ...

1 IPC-9502 PWB Assembly SolderingProcess Guideline forElectronic ComponentsASSOCIATION CONNECTINGELECTRONICS INDUSTRIES2215 Sanders Road, Northbrook, IL 60062-6135 Tel. Fax 1999A standard developed by IPCT able of 12 APPLICABLE Industry Standards .. Industries Association .. 13 TERMS AND 14 APPLICATIONS AND 15 component COMPATIBILITY Compatibility .. Processes .. Exposure Flux and Water Soluble Flux 26 PCB Assembly Process C Oven Reflow Soldering Process .. C Oven Reflow Thermal C Reflow Solder Process .. C Oven Reflow Thermal Solder TH 180 C Preheat .. Side Wave Solder Thermal Solder TH 160 C Preheat .. Side Wave Solder ThermalSpecification .. Solder SM 255 C 130 C Spike .. Solder SM 255 C 130 C SpikeThermal Specification .. Solder SM 255 C 100 C Spike .. Solder SM 255 C 100 C SpikeThermal Specification .. Solder TH & SM .. Phase 217-219 C Max .. Specification.

2 Clean 10 FiguresFigure 1 Document 2 Figure 2 Maximum component Body Profile - ReflowT(max) 235 C .. 4 Figure 3 Maximum component Body Profile - ReflowT(max) 220 C .. 5 Figure 4 Wave Solder TH 180 C - Preheat ProfileBody Temperature Top Side .. 6 Figure 5 Wave Solder TH 160 C - Preheat ProfileBody Temperature Top Side .. 7 Figure 6 component Body Temperature 130 C SMBottom Side .. 8 Figure 7 component Body Temperature - 100 CSpike SM Bottom Side .. 9 TablesTable 1 Moisture Sensitivity Floor Life Levels .. 2 Table 2 Soldering Process 3 Table 3 Chemical Compatibility Levels .. 3 April 1999 IPC-9502iiiPWB Assembly Soldering Process Guidelinefor Electronic Components1 SCOPEThis document describes manufacturing solder Process lim-its that components subjected to IPC-9501, IPC-9503, IPC-9504 and J-STD-020 would survive. It does not includeoptimum conditions for Assembly , but rather guides toassure components are not document applies to both surface-mount (SM) andthrough-hole (TH) components that are wave soldered,reflowed or hand soldered.

3 This document is intended tocomplement other industry documents, listed in :This document does not address the increased tem-perature requirements of lead-free APPLICABLE IPC1 IPC-T-50 IPC Terms and DefinitionsIPC-AC-62 Aqueous Post Solder Cleaning HandbookIPC-TM-650 Test Method to Determine Sensitivity of Electronic Com-ponents to Ultrasonic EnergyIPC-SM-786 Procedures for Characterizing and Handlingof Moisture/Reflow Sensitive ICsIPC-SM-817 General Requirements for Dielectric SurfaceMounting AdhesivesIPC-7711 Rework of Electronic AssembliesIPC-9501 PWB Assembly Process SimulationIPC-9503 Moisture Sensitivity Classification for Non-ICComponentsIPC-9504 Assembly Process Simulation for Evaluation ofNon-IC Joint Industry StandardsJ-STD-002 Solderability Tests for component Leads, Ter-minations, Lugs, Terminals and WiresJ-STD-020 Moisture-Induced Sensitivity Classification forPlastic Integrated Circuit Surface Mount Electronic Industries AssociationJESD22-A113 Preconditioning of Plastic Surface MountDevices Prior to Reliability Testing3 TERMS AND DEFINITIONSS pike= The peak temperature of a component lead on thesolder side of the board while in contact with molten sol-der minus its temperature prior to entering reflow.

4 Thisparameter is also referred to sometimes as the delta T orthermal Rate= Greatest temperature difference in four con-secutive seconds in the entire reflow thermal profiledivided by APPLICATIONS AND OBJECTIVESThe objectives of the document in combination with IPC-9501, IPC-9503, IPC-9504 and J-STD-020 are to: Maintain a common definition of the thermal and chemi-cal SMT and TH Assembly Process requirements that areused to assure compatibility between components andassembly processes. Facilitate the development and manufacture of robustcomponents by establishing a set of levels for solder pro-cess use of this document is illustrated in Figure 1 whichshows typical steps and relationships of this document anddecision points in flow chart form. The intent is to providethe Process levels that the component could be exposed toduring the Assembly processes described include: Storage Soldering of both surface-mount and through-hole com-ponents.

5 Exposure to corrosive fluxes (water soluble). Exposure to cleaning conditions provide levels for the Assembly Process toassure that parts are not following procedures should be followed:1. Review component Process exposure Optimize the Process parameters based on maximizingreliability and IPC, 2215 Sanders Road, Northbrook, IL 60062 April 1999 IPC-95021