Transcription of 高耐熱・低誘電特性を有する SF樹脂を用いた応用 …
1 SF . New Development of High Heat Resistance and Low Dielectric Thermosetting Resin, S. F. Resin . Masaki Takeuchi Eri Yamada . 1 .. SF .. In recent years, thinning of devices and components has led to a problem of warping, which may reduce connection reliability. Low elastic resin material has attracted attention as a possible solution. However, its application range, typified by acrylic resins, is limited, due to low thermal decomposition temperature. New S. F. Resin has low elasticity, high heat decomposition temperature, low dielectric constant, low moisture absorption rate, and many other excellent characteristics. These properties contribute to the development of a no warp heat-resistant temporary fixing material, laminating adhesive, high frequency corresponding material, moisture-proof coating agent, and buffer coating agent. 2 .. UV.
2 3 .. SF .. O O O O. N R N N R N. O O O O. n R: . SF . Figure 1 Structure of S. F. Resin . 28 2016 12 . 4 . SF . SF .. SF GPa 5 435 . SF 10 GHz LCP .. SF . Table 1 Properties of S. F. Resin . Item Condition Unit SF Material A Material B Material C 2. Soluble Resin System Bismaleimide Acryl LCP. Polyimaide 1. Dk 10 GHz A 3. 1. Df 10 GHz A 3. < Tg ppm/ 120 110 100 . CTE X-Y . > Tg ppm/ 180 . Tg TMA 84 160 185 . Elastic Modulus DMA GPa TGA-1%loss 375 250 300 . Td TGA-5%loss 435 320 350 . Peel Strength Low Profile kN/m Water absorption D-23/24 Dielectric 1mm 25 kV/mm 30 22 30 . breakdown voltage 1mm 150 kV/mm 30 . 1 Cavity resonator perturbation method 2 Catalog value 3 Strip-line method 20 0 .. 20 40 60 . 80.. 0. 100 0 5 10 15 20 25. 0 100 200 300 400 500. GHz . TGA . Figure 2 M. easuerment of TGA Figure 3 Dielectric property 5 .. 1 2013 . 2016 12 29.
