Surface Mount Schottky Barrier Rectifiers

1 MSS2P2, General Semiconductor Revision: 17-Dec-20191 Document Number: 89054 For technical questions within your region: DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT Mount Schottky Barrier RectifiersADDITIONAL RESOURCESFEATURES Very low profile - typical height of mm Ideal for automated placement Low forward voltage drop, low power losses High efficiency Meets MSL level 1, per J-STD-020, LF maximum peak of 260 C AEC-Q101 qualified available - Automotive ordering code: base P/NHM3 Material categorization: for definitions of compliance please see APPLICATIONSFor use in low voltage high frequency inverters, freewheeling, DC/DC converters, and polarity protection DATACase: MicroSMP (DO-219AD) Molding compound meets UL 94 V-0 flammability rating Base P/N-M3 - halogen-free, RoHS-compliant, and commercial grade Base P/NHM3_X - halogen-free, RoHS-compliant, and AEC-Q101 qualified ( _X denotes revision code A, B.)

2 Terminals: matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 M3 suffix meets JESD 201 class 2 whisker test, HM3 suffix meets JESD 201 class 2 whisker testPolarity: color band denotes the cathode endPRIMARY CHARACTERISTICSIF(AV) AVRRM20 V, 30 VIFSM30 AVF at IF = VTJ CPackageMicroSMP (DO-219AD)Circuit configurationSingleMicroSMP (DO-219AD)eSMP SeriesTop ViewBottom ViewCathodeAnode333 DDD3D3D ModelsAvailableMAXIMUM RATINGS (TA = 25 C unless otherwise noted)PARAMETERSYMBOLMSS2P2 MSS2P3 UNITD evice marking code 2223 Maximum repetitive peak reverse voltage VRRM2030V Maximum average forward rectified current (fig. 1)IF(AV) forward surge current ms single half sine-wave superimposed on rated loadIFSM30 AOperating junction and storage temperature rangeTJ, TSTG-55 to +150 CMSS2P2, General Semiconductor Revision: 17-Dec-20192 Document Number: 89054 For technical questions within your region: DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE.

3 THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT (1)Pulse test: 300 s pulse width, 1 % duty cycle(2)Pulse test: Pulse width 40 msNote(1)Thermal resistance from junction to ambient and junction to lead mounted on PCB with mm x mm copper pad areas R JL is measured at the terminal of cathode band. R JC is measured at the top center of the bodyNote(1)AEC-Q101 qualifiedRATINGS AND CHARACTERISTICS CURVES (TA = 25 C unless otherwise noted)Fig. 1 - Maximum Forward Current Derating CurveFig. 2 - Forward Power Loss CharacteristicsELECTRICAL CHARACTERISTICS (TA = 25 C unless otherwise noted)PARAMETERTEST instantaneous forward voltageIF = ATA = 25 CVF (1) IF = = ATA = 125 = reverse currentRated VRTA = 25 CIR (2)15250 ATA = 125 junction V, 1 MHzCJ65-pFTHERMAL CHARACTERISTICS (TA = 25 C unless otherwise noted)PARAMETER SYMBOL MSS2P2 MSS2P3 UNIT Typical thermal resistanceR JA (1)105 C/WR JL (1)15R JC (1)20 ORDERING INFORMATION (Example)PREFERRED P/NUNIT WEIGHT (g)PREFERRED PACKAGE CODEBASE QUANTITYDELIVERY MODEMSS2P3-M3 " diameter plastic tape and reelMSS2P3HM3_A/H (1)

4 " diameter plastic tape and reelAverage Forward Rectified Current (A)Lead Temperature ( C) Measuredat the Cathode Band Forward Current (A)Average Power Loss (W)D = = = = = = = tp/TtpTMSS2P2, General Semiconductor Revision: 17-Dec-20193 Document Number: 89054 For technical questions within your region: DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT 3 - Typical Instantaneous Forward CharacteristicsFig. 4 - Typical Reverse CharacteristicsFig. 5 - Typical Junction CapacitanceFig. 6 - Typical Transient Thermal ImpedancePACKAGE OUTLINE DIMENSIONS in inches (millimeters) Title2nd lineInstantaneous Forward Current (A)Instantaneous Forward Voltage (V)TJ= 125 CTJ= 150 CTJ= -40 CTJ= 25 100 Axis Title2nd lineInstantaneous Reverse Current (mA)Percent of Rated Peak Reverse Voltage (%)TJ= 150 CTJ= 125 CTJ= -40 CTJ= 25 Voltage (V)Junction Capacitance (pF) - Pulse Duration (s)Transient Thermal Impedance ( C/W)Junction to ( ) ( ) ( ) ( )Cathode BandMicroSMP (DO-219AD) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( )Mounting Pad ( ) ( )Legal Disclaimer Revision: 01-Jan-20191 Document Number: 91000 Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.

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