YOLE DEVELOPPEMENT Advanced Packaging …

1 Copyrights Yole D veloppementSA. All rights Packaging Platforms: Equipment & MaterialsAdvanced Packaging & Manufacturing TeamYOLE DEVELOPPEMENTCOLLABORATIONINNOVATIONNEW PERSPECTIVESFROM TECHNOLOGIES TO MARKET A comprehensive curveyof Equipment & Materials business, Covering main trends, industry / market structures and market metricsCopyrights Yole D veloppementSA. All rights Report Scope & Companies Cited in this Definitions, Limitations & Analysis Comparison: 2011 vs. 2014 ..10 Who should be interested in this report?..11 Executive Overall Equipment Market Forecasts ($M).

2 30 Breakdown by Advanced Packaging Platform Breakdown by type of equipment Equipment market forecast for 3D & 37 Overview of the technologies Current status Overview of the major equipment suppliers Positioning of the Different Equipment Suppliers, by Technology Challenges/unmet needs Trends of the technology 2013 2019 Market forecast from 2013 to 2019 (in $M, units) Market share (2013) Breakdown details for permanent wafer bonders/ C2W Bonders / DRIE etching & other drilling tools / CVD / PVD / ECD Plating / Exposure & Lithography / Spray coating / Cleaning / Temporary Bonding & De-Bonding / Grinding-Thinning-CMP / Wafer-molding / Inspection & Metrology /Presentation Outline2 YOLEDEVELOPPEMENT2 From TECHNOLOGIES to MARKET Copyright @ Yole All rights reserved Materials market forecast for 3D & 213 2013 2019 Market forecast from 2013 to 2019 (in $M) Market share (2013)

3 Breakdown details for Photoresist & coatings / Adhesive tapes / pre-applied & wafer-level underfills/ Molding compounds / Plating & cleaning chemistries / Slurries for CMP / Temporary bonding materials/ Gas & precursors / sputtering targets 3 DIC & WLP Technologies Process Flows & Manufacturing Trends Focus on Flip-Chip Wafer Bumping Introduction & background Typical manufacturing process flows Equipment & Materials suppliers involved Key process challenges and issues Focus on WL CSP Packaging Focus on FO WLP Packaging Focus on Silicon Interposers Case of Via first TSVfor WLP MEMS Oscillator with TSV Focus on 3D WLP Platform Case of 3 DIC & TSV Via Middle Conclusions & Perspectives.

4 289 Copyrights Yole D veloppementSA. All rights TECHNOLOGIES to MARKET Copyright @ Yole All rights reservedYOLEDEVELOPPEMENT3 Advanced Packaging PlatformsWafer-Level Electrical RedistributionFlip-chip & Wafer-LevelStacking / IntegrationWL CSP Fan-in FOWLP Fan-out wafer bumping on BGA3D IC & TSVE mbedded die in PCB / laminateWafer-Level Interface / Encapsulation3D WLPFor MEMS & sensors(also called 3D SiP)LED & SensorsWLOpticsWafer-level-packageshavee mergedinmanydifferentvarietiesFrom TECHNOLOGIES to MARKET Copyright @ Yole All rights reservedCopyrights Yole D veloppementSA.

5 All rights TECHNOLOGIES to MARKET Copyright @ Yole All rights reservedYOLEDEVELOPPEMENT4 Report Objectives This is a research update on the Equipment & Materials markets for 3D & WLP applications This report sobjectives are to: Providedetailedinformation regardingequipment& materialsusedin 3D IC & WLP to update the market status of the Equipment & Materials markets for 3D & WLP applications Better understand WLP manufacturing technological trends Better understand equipment & materials industries for each process step in the 3D IC & WLP applications Provide an overview of who is doing what.

6 Specificities and market share of each market Gives market metrics both at equipment/material levels for 3D IC & WLP applications Gather and update all the information necessary to benchmark and compare all the different alternatives offered by the current equipment and material toolbox for wafer level Packaging Provide an overview of the technological trends of the equipment & materials technologies The followingapplications are not included: Leadframe-based Packages Thinned, Stacked WB Packages Wire-Bond Ball Grid Array Packages & PoP/PiP Equipment & materials used for Wafer Level Optics Panel will be mentioned in the report but forecast related to this field will not be includedCopyrights Yole D veloppementSA.

7 All rights TECHNOLOGIES to MARKET Copyright @ Yole All rights reservedYOLEDEVELOPPEMENT5 TransformingIC Packaging Supply Chain*System / ProductSub-Module /Sub-systemsDesign & AssemblyDesign of chip & packageWafer LevelPackaging Middle -end SiliconManufacturing Front-end Package Assembly & Final test Back-end Front-end relatedmaterials suppliersOEMs(Original Equipment Makers)FE relatedequipment suppliersBE Packaging materials suppliersBE Packaging equipment suppliersFab-lessIC playersIDMs (Integrated Device Manufacturers)Integrated wafer / package manufacturing foundriesOSATs (Open Source Assembly & Test houses)WLP houses (no need for traditional substrate)PWB suppliers(motherboard)ODM / EMS / DMS(electronic design & manufacturing services)Passive comp.

8 & SMT materialsSMT equipment suppliersSiP design housesPackage substratelaminate suppliersSubstrate material suppliers(FR4, BT resin, Cu clad, ) * Existing business models represented in red, new business models in orange Wafer foundriesFab-light players (outsourcing + focused investment in manufacturing & critical IP)Wafer Bumping housesPCB / PWB houseswithEmbedded die capabilityCopyrights Yole D veloppementSA. All rights TECHNOLOGIES to MARKET Copyright @ Yole All rights reservedYOLEDEVELOPPEMENT6 Involvement of the FE and BE equipment suppliers All the companies from R&D institutes to IP providers, equipment and materials suppliers, foundries, OSATs, IDMs, OEMs, substrate makers have strategically positioned themselves in the Middle-End due to its high growth potential.

9 This evolution will lead to more investment in new equipment and materials The motivations for introducing new manufacturing tools to fulfill 3D technology s requirements drive considerably the entrance of a lot of equipment coming from the front-end and back-end areas in the Middle-End space and create a battlefield between both equipment vendors coming from Front-End and Back-End area who are willing to gain market share in the Middle-End space migration for equipment suppliers towards Middle-End space Depending on the products and applications needs, a trade-off between performance and cost will be needed for the processes that have applications in both front-end and back-end and adopted in 3D integration process flow as well (for instance, lithography, cleaning, deposition, etching etc), Supporting the trends of miniaturization, front-end tools would be preferred for achieving more aggressive features; however, they are typically more expensive.

10 On the other side, the back-end equipment generally exhibits lower cost but can face scaling issues when semiconductor ICs continueto reduce in chip and feature sizeCopyrights Yole D veloppementSA. All rights TECHNOLOGIES to MARKET Copyright @ Yole All rights reservedYOLEDEVELOPPEMENT7$0 M$500 M$1 000 M$1 500 M$2 000 M$2 500 M$3 000 M2013201420152016201720182019 Sales forecasts (M$)Global Equipment & Materialmarketforecastfor 3 DIC & Wafer-Level- Packaging (in M$)Equipment marketMaterial marketYoleDeveloppement November 2014 Equipment & Material Demand in the Mid-End Thewafer-level-packagingmarketremainsahu gebusinessopportunityandshowsthegreatest potentialforsignificantfuturegrowthinthe semiconductorindustry.