Application Note AN068 - TI.com
Application Note AN068 . Adapting TI LPRF Reference Designs for Layer Stacking By Rea Schmid Keywords Board Stacking for RF Design Matching networks for RF Boards VSWR changes with Stacking Discrete Component Balun Design Bandwidth and Layer Stacking Smith Charts and Balun PCB for CC25xx Devices PCB Traces on Smith Charts 062 Mil Layer Stacking Matching to antenna FR4 Dielectric Material RF Filter Design EM for Low Power Wireless CC24xx, CC25xx Board performance for RF Design . 1 Introduction Texas Instruments provides Evaluation impedance, and vias are discussed in this Modules (EMs) for easy characterization of Application note when changing layer the Low Power RF (LPRF) products.
4.2 2-Sided Board Layout A 2-layer board is the easier to deal with than a multi-layer board when considering trace impedances. A two layer board only has a top layer and bottom layer…
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