CMOS Manufacturing Process

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Digital Integrated CircuitsEE141Manufacturing ProcessManufacturing ProcessCMOSManufacturingProcessDigital Integrated CircuitsEE141Manufacturing ProcessManufacturing ProcessCMOS ProcessDigital Integrated CircuitsEE141Manufacturing ProcessManufacturing ProcessA Modern CMOS Processp-welln-wellp+p-epiSiO2AlCupolyn+ SiO2p+gate-oxideTungstenTiSi2DualDual--W ell TrenchWell Trench--Isolated CMOS ProcessIsolated CMOS ProcessDigital Integrated CircuitsEE141Manufacturing ProcessManufacturing ProcessCircuit Under DesignThis two-inverter circuit (of Figure in the text) will bemanufactured in a twin-well Integrated CircuitsEE141Manufacturing ProcessManufacturing ProcessCircuit LayoutDigital Integrated CircuitsEE141Manufacturing ProcessManufacturing ProcessThe Manufacturing ProcessFor a great tour through the Process and its different steps, a complete walk-through of the Process (64 steps), check theBook web-pageDigital Integrated CircuitsEE141Manufacturing Process

Hardened resist Hardened resist Chemical or plasma etch. Digital Integrated Circuits Manufacturing Process EE141 CMOS Process at a Glance Define active areas Etch and fill trenches Implant well regions Deposit and pattern polysilicon layer Implant source and drain regions and substrate contacts

  Process, Manufacturing, Hardened, Manufacturing process