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A Nickel-Palladium-Gold Integrated-Circuit Lead …
Application ReportSZZA031 - December 20011A Nickel-Palladium-Gold Integrated Circuit Lead Finishand Its Potential for Solder-Joint EmbrittlementDonald Abbott, Douglas Romm, Bernhard LangeStandard Linear & LogicABSTRACTThis gold (Au) embrittlement study evaluates TI s original four-layer nickel- palladium (NiPd)lead finish that was introduced in 1989 and TI s Nickel-Palladium-Gold (NiPdAu) lead finishthat replaced four-layer NiPd in 2001. Samples were prepared with three different Authicknesses for the NiPdAu components. The printed wiring board (PWB) finishes used wereorganic solderability preservative (OSP) and electroless nickel- gold (NiAu). The latter weremade with two different Au thicknesses. The goal was to understand the effect of Au from thecomponent finish and the PWB pad finish on Au embrittlement in the solder joint.
Application Report SZZA031 - December 2001 1 A Nickel-Palladium-Gold Integrated Circuit Lead Finish and Its Potential for Solder-Joint Embrittlement
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