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(AUTOMATIC VISUAL INSPECTION) for Probe …
PRESENTSU sing AVI (AUTOMATIC VISUAL INSPECTION) for Probe Mark InspectionandImplementing AVIinto theTest Floor Production ProcessMamo Matsushime Texas Instruments, HijiMike ClaySTI, 12, 2000 SemiconductorTechnologies &InstrumentsJune 12, 20002 Part One:Using AVI for Probe Mark InspectionJune 12, 20003 OUTLINE! Probe Mark Defects Detectable!Bond Pad Damage Detectionas qualified at CM I!capture rate and range !Bond Pad Damage Detectionas quantified at T I!accuracy correlationJune 12, 20004 Probe Mark Defects Detectable with AVI:Edge ExcursionJune 12, 20005 Probe Mark Defects Detectable with AVI:Pad DiscolorationJune 12, 20006 Probe Mark Defects Detectable with AVI:Pad DamageJune 12, 20007 Bond Pad Damage Detection:As Qualified at Cypress Semiconductor, MinnesotaSample=289 dieMax areapass/failsettingManualcountAVIC ountFail tocaptureFalsedefects% fail tocapture% false capture30%3939000% : DIE LEVEL inspection ** Bond pad level Probe mark area inspection accuracy is Range determined bytesting one borderline bond pad (56 pixels = 25% area probed) 100 %Accuracy and Repeatability for Percentage of Pad Damage:Capture Rate and Range[These data provided by Dane Christian, Cypress Semico]
PRESENTS Using AVI (AUTOMATIC VISUAL INSPECTION) for Probe Mark Inspection and Implementing AVI into the Test Floor Production Process Mamo Matsushime Texas Instruments, Hiji
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