Transcription of Ball Grid Array (BGA) Packaging - Intel
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Ball Grid Array (BGA) Packaging - Intel
2000 Packaging Databook 14-1 ball grid Array (BGA) plastic ball grid Array (PBGA) has become one of the most popular Packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems and minimized handling issues. During reflow the solder balls are self-centering (up to 50% off the pad), thus reducing placement problems during surface mount. Normally, because of the larger ball pitch (typically mm) of a BGA over a QFP or PQFP, the overall package and board assembly yields can be better. From a performance perspective, the thermal and electrical characteristics can be better than that of conventional QFPs or PQFPs. The PBGA has an improved design -to-produc-tion cycle time and can also be used in few-chip-package (FCPs) and multi-chip modules (MCMs) configurations.
Ball Grid Array (BGA) Packaging 14-4 2000 Packaging Databook Figure 14-2. HL-PBGA Die Down Cross-Section Figure 14-3. FC-Style, H-PBGA Die Up Cross-Section A5765-01 Copper Slug/Heatspreader Encapsulant Die Down Design Solder Balls BT PCB Laminate A7428-01 BT Lamintate C4 Bumps Die-up Design Underfill Solder balls
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