Transcription of ChinalntegratedCircult CIC 中国集成电路
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ChinalntegratedCircult CIC 中国集成电路
China lntegrated CircultCIC2014 12 http 187 CorePowerDeliveryNetworkAnalysisofCorean dCorelessSubstratesinaMultilayerOrganicB uildupPackageOzgurMisman,MikeDeVita,Noza dKarim AmkorTechnology,Inc.,1900 SouthPriceRoad,Chandler,AZ85286,USA Abstract:The use of flip chip organic buildup substrates is a popular choice for large Application Specific IntegratedCircuits ASICs due to the high routing density they offer at a relatively reasonable cost. A typical buildup packageconsists of multiple high density routing layers buildup layers supported by a thick core. The laminate core addsrigidity to the substrate and can be configured to various thicknesses such as 400 m, 600 m and 800 m. Corelesssubstrates are an emerging technology targeted to increase the routing density, lower the package z height, whileproviding better electrical performance. This is primarily due to the replacement of thick core layers with a thinbuildup layer. As the trend for higher levels of performance and system bandwidth continues, coreless technology iswell positioned as an enabling technology this paper we compare the performance of the core power delivery network Core-PDN of two 31mm, 900 ball, 8layer organic flip chip buildup substrates.
Core Power Delivery Network Analysis of Core and Coreless Substrates in a Multilayer Organic Buildup Package Ozgur Misman, Mike DeVita, Nozad Karim 渊Amkor Technology, Inc., 1900 South Price Road, Chandler, AZ85286, USA冤 ...
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