Transcription of Figure 1: SOURCE: Amkor Technology, Inc.
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Figure 1: SOURCE: Amkor Technology, Inc.
4444 Chip Scale Review September October 2017 [ ]Challenges in automotive package developmentBy Shaun Bowers [ Amkor technology , Inc.]utomotive package development in outsourced semiconductor assembly and test suppliers (OSATS) is a natural extension of the market forces that established the OSAT market in the 20th century. The motivation to re-use technology , cross-pollinate approaches, standardization, and a lower barrier to entry for new package types all apply to automotive as well as standard OSAT packaging services. The trend to adopt new and varied package types to automotive applications is a direct response to the market forces that are increasing the semiconductor content in automobiles at an exponential rate.
semiconductor assembly and test suppliers (OSATS) is a natural ... increasing the semiconductor content in automobiles at an exponential rate. ... IWLPC is at the forefront of packaging technology evolution. Addressing Wafer-Level Packaging, 3D Packaging, and Advanced Manufacturing & Test ...
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