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倒装芯片 CSP (fcCSP)

FcCSP core core ( possum ) (AiP) fcCSP f f f BGA f AP BB RF PMIC f f core core f f 1 x 1 mm2 25 x 25 mm2 f 50 30/60 fBGA f f f f f ( possum ) f Amkor Technology CSP (fcCSP)

(POSSUM™) 则使封装内天线 (AiP) 成为可能。最后,借助于铜柱凸块晶片,用来说,fcCSP 封装是非常具有吸 fcCSP 技术能够利用小节距基板布线和凸块节距的优势,在减少层数与成本的同 时优化其电气性能。(包括 5G)、适用于汽车的信息娱乐和 特色

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