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倒装芯片 CSP (fcCSP)

FcCSP core core ( possum ) (AiP) fcCSP f f f BGA f AP BB RF PMIC f f core core f f 1 x 1 mm2 25 x 25 mm2 f 50 30/60 fBGA f f f f f ( possum ) f Amkor Technology CSP (fcCSP)

(POSSUM™) 则使封装内天线 (AiP) 成为可能。最后，借助于铜柱凸块晶片，用来说，fcCSP 封装是非常具有吸 fcCSP 技术能够利用小节距基板布线和凸块节距的优势，在减少层数与成本的同时优化其电气性能。（包括 5G）、适用于汽车的信息娱乐和特色

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Transcription of 倒装芯片 CSP (fcCSP)

1 FcCSP core core ( possum ) (AiP) fcCSP f f f BGA f AP BB RF PMIC f f core core f f 1 x 1 mm2 25 x 25 mm2 f 50 30/60 fBGA f f f f f ( possum ) f Amkor Technology CSP (fcCSP)

2 CSP Amkor z CSP (fcCSP) | fcCSP 5G ADAS fcCSP RF f x mm2 16 x 16 mm2 f 1 x 1 mm2 25 x 25 mm2 f LF 80 m f 30/60 m Amkor Amkor Amkor Amkor Amkor Amkor Technology, Inc.

3 2020 Amkor Technology, Incorporated. DS577I-CN 04/20 CSP (fcCSP) f ABF f f (MUF) (CUF) f f f / f f f -55 C +165 C f f fJEDEC possum