Transcription of Data Sheet Au Bump - LBSemicon
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Data Sheet Au Bump - LBSemicon
Rev Date: 8/17 Data Sheet _ au bump l 2 au bump Overview Gold bumped wafer will be applied on TCP (Tape Carrier Package), COG (Chip on Glass), COF(Chip on Film) package primarily for consumer products. It is designed to replace wire bond technology .The gold bumped chip will be mounted on the package through thermal compression method. As the requirement in high I/O, flex interconnection, thin, lightweight packaging increase, gold bumped wafers become more suitable to these portable products. Application COF and COG package for TV, Monitor, Notebook DDIC, Mobile, Tablet, Automotive Process capability 8inc and 12inch wafer available Au Bumping process Various hardness available from 50Hv up to 90Hv Low level : 50 20Hv Middle Level : 75 20Hv High level : 90 20Hv Bump height
www.lbsemicon.com l www.facebook.com/lbsemicon2017 2 Au Bump Overview Gold bumped wafer will be applied on TCP (Tape Carrier Package), COG (Chip on
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