Transcription of Device Fabrication Technology1
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593 Device Fabrication Technology1 CHAPTER OBJECTIVESW hile the previous chapters explain the properties of semiconductors, this chapter willexplain how devices are made out of the semiconductors. It introduces the basictechniques of defining physical patterns by lithography and etching, changing thedoping concentration by ion implantation and diffusion, and depositing thin films overthe semiconductor s substrate. One section describes the techniques of fabricating theimportant metal interconnection structures. It is useful to remember the names of thekey techniques and their acronyms, as they are often used in technical discussions.
flat-panel displays, micro-electro-mechanical systems (MEMS), and even DNA chips for DNA screening. The rest of this chapter provides an introduction to the modern device processing technology. Perhaps the most remarkable advances have occurred in the fields of lithography (Section 3.3) and interconnect technology (Section 3.8).
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