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Device Fabrication Technology1 - Chenming Hu

593 Device Fabrication Technology1 CHAPTER OBJECTIVESW hile the previous chapters explain the properties of semiconductors, this chapter willexplain how devices are made out of the semiconductors. It introduces the basictechniques of defining physical patterns by lithography and etching, changing thedoping concentration by ion implantation and diffusion, and depositing thin films overthe semiconductor s substrate. One section describes the techniques of fabricating theimportant metal interconnection structures.

FIGURE 3–4 The SiO2 thickness formed on (100) silicon surfaces as a function of time. (From [2]. Reprinted by permission of Pearson Education, Inc., Upper Saddle River, NJ.) Quartz tube Flow controller H Resistance-heated furnace O N 2 O Si wafers 1.0 Oxidation time (h) Oxide thickness (m) 0.1 0.01 0.1 1.0 (100) 1,100 C wet 1,000 C wet 900 C ...

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