Transcription of ELECTRONICS INDUSTRIES Performance Test Methods and ...
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IPC-9701 APerformance TestMethods and QualificationRequirements for SurfaceMount solder AttachmentsDeveloped by the SMT Attachment reliability Test Methods Task Group(6-10d) of the Product and reliability Committee (6-10) of IPCU sers of this publication are encouraged to participate in thedevelopment of future :IPC3000 Lakeside Drive, Suite 309 SBannockburn, Illinois60015-1219 Tel 847 847 :IPC-9701 - January 2002 ASSOCIATION CONNECTINGELECTRONICS INDUSTRIES Table of .. Classification .. of Terms .. 12 APPLICABLE .. Industry Standards .. Tin Research Institute .. Publications .. INDUSTRIES Association .. Working Group .. 23 TERMS, DEFINITIONS AND .. Concepts .. Definition .. Concepts .. Relaxation .. Creep-Fatigue Model .. Thermal Expansion .. Parameters .. Zone .. Temperature Range/Swing .. Temperature: Ts .. Sample Temperature: Ts (max) .. Nominal Temperature: T (max) .. Sample Temperature: Ts (min).
establishes different levels of performance and reliability of the solder attachments of surface mount devices to rigid, flexible and rigid-flex circuit structures. In addition, it pro-vides an approximate means of relating the results from these performance tests …
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