Transcription of Evaluating Surface Roughness of Si Following …
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1 Lapping and Polishing Purpose Lapping and polishing of samples is a common application and required for a variety of manufacturing and research processes. A wide range of techniques and methods can be implemented for any given polishing process and the type selected depends on the ultimate requirements of the sample. Surface finish, sample flatness and parallelism, and Surface quality are all to be considered when selecting a polishing process. Each process type has different overall characteristics and can be of greater benefit depending on the final application of the sample.
3 Lapping and Polishing Results All of the scans were taken using the same parameters as described in the section above. Roughness data were collected, giving the Ra and RMS both for each sample.
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