Transcription of High-End Performance Packaging: 3D/2.5D Integration 2020
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High-End Performance Packaging: 3D/2.5D Integration 2020
From Technologies to Markets 2020 High-End Performance Packaging: 3 Integration 2020 Market and Technology ReportSample2 Tableofcontents2 Scopeofreport4 Reportmethodologies&definitions6 Keyfeaturesofthisreport5 Abouttheauthor7 YoleGroupofcompaniesrelatedreports9 Glossaries11 Companiescitedinthisreport12 3-Pagesummary13 Executivesummary17 Context66oSemiconductorindustry playerspursuingMoore slaw67oHigh-endperformancepackagingdefin ition71oScopeofreport72oHigh-endperforma ncepackagingmarketsegment73oHigh-endperf ormancepackagingintroduction74 Marketforecasts75oMarketRevenue76oTotalm arketrevenueoSplitbyend-marketoSplitbyte chnologyoMarketUnits80oTotalmarketunitso Splitbyend-marketoSplitbytechnologyHigh- end Performance Packaging: 3 Integration 2020 | Sample | | 2020 TABLE OF CONTENTSPart 1 Markettrends96oCloud&edgecomputing97oClo udcomputingandnetworking103oHigh-Perform anceComputing(HPC)111oArtificialintellig enceforautonomousvehicles119oChapterconc lusion125 Commercializedproductsanditssupplychain1 27oProductlaunches130o3 Dstackedmemorieso(x)PUoGPUforHPCoSupplyc hainforhigh-endperformancepackaging156oG lobalmappingofhigh-endpackagingoGlobalma ppingbasedontechnologyoSupplychainforhig h-endpackagingproductsoLatestprogressofk eyplayers1753oSupplychainanalysisinhigh- endperformancepackaging188oPackaging supply chain analysisoAnalyst s point of view on supply
o Cloud computing and networking 103 o High-Performance Computing (HPC) 111 o Artificial intelligence for autonomous vehicles 119 o Chapter conclusion 125 Commercialized products and its supply chain 127 o Product launches 130 o 3D stacked memories o (x)PU o GPU for HPC o Supply chain for high-end performance packaging 156
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