Transcription of 半導體製程與設備介紹 - isu.edu.tw
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半導體製程與設備介紹 - isu.edu.tw
Oxidization( )Lithography( )Etching( )Diffusion Ion Implantation( )Deposition( )Wafer Inspection( )Dicing( )Mounting( )Bonding( )Molding( )Testing( )Wafer Cutting( )Wafer Grinding( )Forming( )Marking( )Trimming( )IC ( ) ::IC IC :: ( ( ) ICIC IC IC IC IC IC ( 85 C) LOC (Lead on Chip) BGA (Ball Grid Array) BGA MCM (Multi-chip Module ) ICIC (Dicing) (Die Mount/Die Attach) Pick & Place (Snap Curing Oven) (Wire Bond) , (20~50 m) , (Molding) 1.)
義守大學 機動系 什麼是電子構(封)裝 • 封裝說明: ic構裝係屬半導體產業的後段加工製 程，主要是將前製程加工完成（即晶圓廠所生產）之
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