Transcription of 半導體製程與設備介紹 - isu.edu.tw
1 Oxidization( )Lithography( )Etching( )Diffusion Ion Implantation( )Deposition( )Wafer Inspection( )Dicing( )Mounting( )Bonding( )Molding( )Testing( )Wafer Cutting( )Wafer Grinding( )Forming( )Marking( )Trimming( )IC ( ) ::IC IC :: ( ( ) ICIC IC IC IC IC IC ( 85 C) LOC (Lead on Chip) BGA (Ball Grid Array) BGA MCM (Multi-chip Module ) ICIC (Dicing) (Die Mount/Die Attach) Pick & Place (Snap Curing Oven) (Wire Bond) , (20~50 m) , (Molding) 1.)
2 2. 3. 4. Junk (Flash) (Marking) 1. (Ink) : (PAD) IC 2. (Laser) : IC IC Ink Dejunk Deflash Punch Package Dam Bar Dam Bar D/T D/T Trimming Inner Lead Package Punch Dam Bar Outer Lead D/T D/T Mark Lead Frame Tie Bar Package Lead Frame Tie (Singulation) F/S F/S Forming Singulation Package Outer lead JJ F/S F/S (b)(a) (Trim/Form) (Inspection) The E
