半導體與封裝專業英語常用術語 - isu.edu.tw

1 A or Angstrom/ m Prefix Symbol Factor yotta Y 1024 zetta Z 1021 exa E 1018 peta P 1015 tera T 1012 giga G 109 mega M 106 kilo k 103 hecto h 102 deka da 101 deci d 10-1 centi c 10-2 milli m 10-3 Micro 10-6 Nano n 10-9 Pico p 10-12 Femto f 10-15 Atto a 10-18 Zepto z 10-21 Yocto y 10-24 Active component/ AT C accelerated thermal cycling / Alloy/ Ambient/ Ambient Temperature/ Analog circuits/ ANSI American National Standards Institute / ASIC application specific integrated circuit / AST accelerated stress testing / B Batch Manufacturing/ Batch Processing/ BEOL back-end of line / BGA ball grid array / Burn in/ C C4 controlled collapse chip connection / Capacitance/ CBGA ceramic ball grid array / Ceramic substrates/ CSP chip scale package or chip size package / 20% Circuit/ Clean room/ CMOS complementary metal oxide semiconductor / N P COB chip-on-board / Coplanarity/ CPLD complex programmable logic device IC / C-SAM c-mode scanning acoustic microscopy / CSP-C CSP ceramic / CSP-L CSP laminate / CTE

2 Coefficient of thermal expansion / D Daughter card/ DCA direct chip attach / Die/ chip microchip dice Dielectric/ DIPs dual inline package / 8~40 Distributed processing/ DNP distance to neutral point / Doping/ D PA destructive physical analysis / DRAM dynamic random access memory / DRAM DSP digital signal processors / DSP E EIA Electronic Industries Alliance / EIAJ Electronic Industries Association of Japan / Etching/ Eutectic/ Expansion board/ F Fabless Fabrication L ess / foundry Fault tolerance/ FBGA fine-pitch BGA / FC flip chip / FCB flip chip bump / FCIP flip chip in package / FCOB flip chip on board / Flexible printed circuit/ Flexible substrate/ Flip-Chip-On-Flex/ Flux/ FOC flex-on-cap / Delphi Delco Electronics Systems FCT Footprint/ / Foundry/ G GaAs

3 Gallium Arsenide / LED Gigabyte/ 1 8 Glob Top Pad Array Carrier GT PA C / H Hard disk drive HDD / HDI high density interconnect / HDIS high density interconnect structure or system / HTOL high temperature operating life / HTS high temperature storage / I IEEE Institute of Electrical and Electronics Engineers / I/O input/output / / I300I International 300-mm wafer Initiative / Integrated circuit/ Interconnect/ IMAPS International Microelectronics And Packaging Society / IMC intermetallic compound / IMCM-Board integrated multi-chip-module-board / In-line automation/ Inner Lead Bond ILB / Interposer/ IPC Institute for Interconnecting and Packaging Electronic Circuits / ITRI Industrial Technology Research Institute / J JEDEC Joint Electronic Devices Engineering Council / K KGD.

4 KGW known good die/wafer / L Laminate/ Lead Frame/ LED light emitting diode / Lithography/ LSI Large-scale integration IC / LT C C Low temperature co-fired ceramic / M Mask/ MCM-C multichip module ceramic / MCM-L multichip module laminate / MCM/ MES manufacturing execution systems / Metallization/ Micron or micrometer/ 10-6mil/ 75-80 mHz/ MHz/ MIS management information system / MLB multilayer board / MMI microelectronics manufacturing infrastructure / MMRC Microelectronics Marketing Research Council of IMAPS Motherboard/ N nanometer nm / 10-9 NIC network interface card / 1000 =1 NCMS national center for manufacturing sciences / NEMI National Electronics Manufacturing Initiative NIST National Institute of Standards and Technology O OEM original equipment manufacturer / Open systems/ Outer Lead bond OLB / Over mold pad array carrier OMPAC / Oxidation/ P Pad/ Passivation/ PBGA plastic ball grid array / Personal Computer Memory Card International Association PCMCIA PGA Pin Grid Array.

5 Pad Gird Array / Photoresist/ Pitch/ Plasma/ ppm parts per million / Printed circuit board PCB / PVI package visual inspection / Printed Wiring Board PWB / Q QFP quad flat package / R Reflow process/ (SMD) RC resistance-capacitance / - Reticle/ RF radio frequency / RH relative humidity / Rework/ S SBB solder ball bumping or solder bump bonding, also stud bump bonding SDRAM synchronous RAM / SEM scanning electron microscope / SEMATECH Semiconductor Manufacturing TECH nology consortium SEMI Semiconductor Equipment and Materials International Semiconductor/ Si Silicon / SIA Semiconductor Industry Association / SiP system-in-package / System-on-Package SoP SiPs single in-line packages / SIMMs single in-line memory modules / SMD surface mount device / SoP system-on-package / Solder/ Solder mask/ Solid state/ Sputter/ SRC Semiconductor Research Corporation / Stepper/ Substrate/

6 Surface mount technology SMT / Systems integration/ T Tape automated bonding TAB / PI TAP test, assembly and packaging / Tape and reel/ TBGA tape ball grid array / TCP tape carrier package / Tg glass transition temperature / TQFP thin quad flat package / TSOP thin small-outline package / Turnkey/ U UBM under bump metallurgy, also known as pad limiting metallurgy PLM Underfill/ V VLSI very large scale integration / Y Yield/ Z Zig-zag in-line package ZIP /