Transcription of Laser Application - Disco Corporation
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Laser Application - Disco Corporation
Laser ApplicationAblation ProcessDAL7020 DFL7020 DFL7161 DFL7160 Stealth DicingDFL7341 DFL7360 FHDFL7361 Laser Lift ExamplesLow-kGrooving Inhibitsdelamination(filmpeeling)LaserFu llCut Increasesthenumberofdieperwaferbystreetr eduction Improvesthefeedspeed(comparedtobladedici ng)SapphireGrooving Realizesstableprocessingwhilerestraining sapphirebrightnessdeterioration ImprovesCoOwithashaperecognitionfunction forbrokenwafersandwithmultiple-mountedwa ferprocessingSi+DAFfullcut HighqualitycuttingofDAF(dieattachfilm)SE M x200 Feed speed: 600 mm/s cutSEM x2000 SEM x500 Wafer thickness: 80 mSEM x100 Feed speed: 150 mm/s Wafer thickness: 90 mSEM x750 Wafer thickness: 30 m DAF thickness: 80 mSEM x150 Wafer thickness: 100 mSEM x400 Feed speed: 500 mm/s, 3 passesWafer
Laser Application Ablation Process DAL7020 DFL7020 DFL7161 DFL7160 Stealth Dicing DFL7341 DFL7360FH DFL7361 Laser Lift Off DFL7560L
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