Transcription of Low Warpage Coreless Substrate for IC Packages
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Low Warpage Coreless Substrate for IC Packages
55 Kurashina et al.: Low Warpage Coreless Substrate (1/8)1. BackgroundWith a continuous enhancement of performance and feature downsizing of electronic products, the use of Ball grid array (BGA) Packages is spreading rapidly as elec-tronic products because of their advantage in higher pin counts. Moreover, in keeping with the IC upsizing pace, even more fine BGAs are necessar y, and as a result, the development of high reliability assembly processes for fine-pitch ICs had become essential. We believe that one of the important factors for the BGA performance is dielec-tric materials, which include ceramics[1] and organic materials.
55 Kurashina et al.: Low Warpage Coreless Substrate (1/8) 1. Background With a continuous enhancement of performance and feature downsizing of electronic products, the use of Ball grid array (BGA) packages is spreading rapidly as elec-
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