Transcription of Microelectronics Reliability: Physics-of-Failure …
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National Aeronautics and Space Administration Microelectronics reliability : Physics-of-Failure Based Modeling and Lifetime Evaluation Mark White Jet Propulsion Laboratory Pasadena, California Joseph B. Bernstein University of Maryland College Park, Maryland Jet Propulsion Laboratory California Institute of Technology Pasadena, California JPL Publication 08-5 2/08. National Aeronautics and Space Administration Microelectronics reliability : Physics-of-Failure Based Modeling and Lifetime Evaluation NASA electronic Parts and Packaging (NEPP) Program Office of Safety and Mission Assurance Mark White Jet Propulsion Laboratory Pasadena, California Joseph B.
iii PREFACE The solid-state electronics industry faces relentless pressure to improve performance, increase functionality, decrease costs, and …
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Article Title: SPICE Models For Power Electronics, Article Title: "SPICE Models For Power Electronics, Power, Using Texas Instruments SPICE Models in, Using Texas Instruments Spice Models in Electronics, Converter System Modeling via MATLAB/Simulink, Spice, S Guide to LTSpice Introduction, S Guide to LTSpice Introduction SPICE, Accelerating Power-Supply Compliance to, Accelerating Power-Supply Compliance to Specification, Reliability Models to Predict Engineering, Reliability Models to Predict Engineering Systems 'Failures and