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Microelectronics Reliability: Physics-of-Failure Based ...
National Aeronautics and Space Administration Microelectronics Reliability: Physics-of-Failure Based Modeling and Lifetime Evaluation Mark White Jet Propulsion Laboratory Pasadena, California Joseph B. Bernstein University of Maryland College Park, Maryland Jet Propulsion Laboratory California Institute of Technology Pasadena, California JPL Publication 08-5 2/08. National Aeronautics and Space Administration Microelectronics Reliability: Physics-of-Failure Based Modeling and Lifetime Evaluation NASA Electronic Parts and Packaging (NEPP) Program Office of Safety and Mission Assurance Mark White Jet Propulsion Laboratory Pasadena, California Joseph B. Bernstein University of Maryland College Park, Maryland NASA WBS: JPL Project Number: 102197. Task Number: Jet Propulsion Laboratory 4800 Oak Grove Drive Pasadena, CA 91109. This research was primarily carried out at the University of Maryland under the direction of Professor Joseph B.
AST Accelerated Stress Tests ATPG Automatic Test Pattern Generation AVSI Aerospace Vehicle Systems Institute BERT Berkeley Reliability Tools BIR Built-In-Reliability BTI Biased Temperature Instability CAD Computer Aided Design CADMP-2 Computer-Aided Design of Microelectronic Packages
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