Transcription of PE42525 and PE426525 Performance Optimization
{{id}} {{{paragraph}}}
PE42525 and PE426525 Performance OptimizationApplication Note 66 2015-2017, Peregrine Semiconductor Corporation. All rights reserved. Headquarters: 9380 Carroll Park Drive, San Diego, CA, 92121 Application NoteDOC-81384-2 (08/2017) application note provides the recommended landing pattern and assembly process for achieving optimum Performance with the PE42525 and PE426525 . The PE42525 and PE426525 are flip-chip, single-pole double-throw (SPDT) switches that support a wide frequency range from 9 kHz to 60 GHz. The PE42525 is suited for test and measurement (T&M), microwave backhaul, and radar and military communications (mil-comm) applications. The PE426525 is ideal for applications that require extended temperature support in the 55 C to +125 C range, such as harsh industrial applications.
Application Note 66 PE42525/PE426525 Optimization DOC-81384-2 – (08/2017) Page 3 www.psemi.com Alumina Substrate Figure 2 and Figure 3 show two recommended metalization patterns and via placements for alumina substrate carriers on which the PE42525 and PE426525 are assembled.
Domain:
Source:
Link to this page:
Please notify us if you found a problem with this document:
{{id}} {{{paragraph}}}
Material for High Frequency Signal, Material for High Frequency Signal Transmission of Substrates, Low Warpage Coreless Substrate, Substrates, High, FPC Technical Guide, For high, Transmission, Advanced Organic Technology for 2.5D Interposer, Material, Developments in Glass Yarns and Fabric Constructions, Xilinx UG393 Spartan-6 FPGA PCB Design, Spartan-6 FPGA PCB Design, Xilinx