Transcription of Low Warpage Coreless Substrate for IC Packages
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Low Warpage Coreless Substrate for IC Packages
55 Kurashina et al.: Low Warpage Coreless Substrate (1/8)1. BackgroundWith a continuous enhancement of performance and feature downsizing of electronic products, the use of Ball grid array (BGA) Packages is spreading rapidly as elec-tronic products because of their advantage in higher pin counts. Moreover, in keeping with the IC upsizing pace, even more fine BGAs are necessar y, and as a result, the development of high reliability assembly processes for fine-pitch ICs had become essential. We believe that one of the important factors for the BGA performance is dielec-tric materials, which include ceramics[1] and organic materials.[2 4] We have been continuously developing buildup BGA substrates making use of organic materi-als[5] that are more advantageous over ceramics because of their low cost and microfabrication Substrate consists of core layers reinforced by glass cloths and buildup layers consisting of resin films.
56 Transactions of The Japan Institute of Electronics Packaging Vol. 5, No. 1, 2012 less substrates include no core layers with high rigidity, thermal warpage of coreless substrates becomes larger
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