Transcription of Photolithography Overview for MEMS
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Photolithography Overview Photolithography Overview for MEMSfor MEMS Knowledge ProbeKnowledge Probe Photolithography Overview PKPhotolithography Overview PK ActivityActivity TerminologyTerminology ActivityActivity Resist ThicknessResist Thickness Participant GuideParticipant Guide Southwest Center for Microsystems Education (SCME) University of New Mexico MEMS Fabrication Topic Photolithography Overview for Microsystems Knowledge Probe (Pre-Quiz) Shareable Content Object (SCO) This SCO is part of the Learning Module Photolithography Overview Target audiences: High School, Community College, University Support for this work was provided by the National Science Foundation's Advanced Technological Education (ATE) Program through Grant #DUE 0902411.
Microsystems fabrication uses several layers to build devices. These layers typically consist of thin films of metal, bulk silicon, silicon dioxide or nitride, or polysilicon. The graphic illustrates the layers of a MEMS linkage assembly. Each layer is a different component of that device. Each layer requires a different pattern.
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