Transcription of PHOTOLITHOGRAPHY OVERVIEW FOR MICROSYSTEMS
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PHOTOLITHOGRAPHY OVERVIEW FOR MICROSYSTEMS
PHOTOLITHOGRAPHY OVERVIEW FOR MICROSYSTEMSP hotolithography OVERVIEW Learning ModulePatterned Mask forPhotolithography Expose2 PHOTOLITHOGRAPHY and MEMSvMicrosystems (MEMS) fabrication uses several layers to build devices. vEach layer of this linkage system is a different component of the device and requires a different defines and transfers a pattern to each respective layer. MEMS Linkage Assembly[Linkage graphic courtesy of KhalilNajafi, University of Michigan]3 PhotolithographyEach layer within a microsystemhas a unique pattern. vPhotolithography transfers this pattern from a mask to a photosensitive layer. vAnother process step transfers the pattern from the photosensitive layer into an underlying layer. vAfter the pattern transfer, the resist is stripped (removed).Pattern Transfer to Underlying Layer4 Three Steps of PhotolithographyvCoatvExposevDevelop5 Coat Step: Surface ConditioningIn most applications, surface conditioning precedes the photoresist. vSurface conditioning prepares the wafer to accept the photoresist by providing a clean coats the wafer with a chemical that boosts adhesion of the photoresist to the wafer s surface.
Jul 10, 2012 · Photolithography and MEMS v Microsystems (MEMS) fabrication uses several layers to build devices. v Each layer of this linkage system is a different component of the device and requires a different pattern. v Photolithography defines and transfers a pattern to each respective layer. MEMS Linkage Assembly
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