Transcription of Reflow Soldering Process Considerations for …
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Reflow Soldering Process Considerations for Surface Mount Applicationby Jim BergenthalF-2102A 7/95 Reprinted 10/97 Electronics Corporation P. O. Box 5928 Greenville, SC 29606 Phone (864) 963-6300 Fax (864) INTRODUCTIONR eflow Soldering , like wave Soldering , is not anew manufacturing Process . The hybrid industry hasused and refined the art of Reflow Soldering for manyyears. However, with the advent of Surface MountTechnology (SMT), Reflow Soldering has expanded inthe number of types and has been studied, refinedand explored as never different opinions have been expressedabout the best Process . We have found that the bestor optimum Process is the solder Process whichresulted in meeting the goals of Reflow Soldering forthe SMT application. You can select the optimumsolder Reflow Process for your application if you: Understand the goals.
Reflow Soldering Process Considerations for Surface Mount Application by Jim Bergenthal F-2102A 7/95 Reprinted 10/97 Electronics Corporation P. O. Box 5928
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QFN/SON PCB Attachment, Considerations, Process, Soldering, Soldering Considerations, IPC/JEDEC J-STD-033C, Reflow, Moisture/Reflow Sensitive Surface Mount Devices, Surface Mount - Mounting Pad Dimensions and, Surface Mount - Mounting Pad Dimensions and Considerations, Ball Grid Array Package Reference Guide