Transcription of Soldering and Mounting Techniques - ON …
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Soldering and Mounting TechniquesSOLDERRM/DRev. 11, March 2016 Reference Manual SCILLC, 2016 Previous Edition, 2015 All Rights Reserved , MicroLeadless, MOSORB, MiniMOSORB, and POWERTAP are trademarks of Semiconductor Components Industries, LLC(SCILLC) or its subsidiaries in the United States and/or other countries. Cho Therm is a registered trademark of Chromerics, Inc. Grafoilis a registered trademark of Union Carbide. Kapton is a registered trademark of du Pont de Nemours & Co., Inc. Kon Dux and Rubber Duc are trademarks of Aavid Thermal Technologies, Inc. PowerFLEX is a trademark of Texas Instruments Incorporated. Thermasil is aregistered trademark and Thermafilm is a trademark of Thermalloy, Inc.
SOLDERRM http://onsemi.com 10 Soldering Considerations for Surface Mount Packages RECOMMENDED FOOTPRINTS FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total
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Reflow Soldering Process Considerations for, Reflow Soldering Process Considerations for Surface, QFN/SON PCB Attachment, Considerations, Process, Moisture/Reflow Sensitive Surface Mount Devices, Surface Mount - Mounting Pad Dimensions and, Surface Mount - Mounting Pad Dimensions and Considerations, Soldering, Ball Grid Array Package Reference Guide