Transcription of QFN/SON PCB Attachment - TI.com
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QFN/SON PCB Attachment - TI.com
ApplicationReportSLUA271A June2002 RevisedSeptember2007 QFN/SONPCBA ttachmentSteveKummerl,BernhardLange, (QFNs)andsmall-outlinenoleads(SONs)arele adlesspackageswithelectricalconnectionsm adevialandsonthebottomsideofthecomponent tothesurfaceoftheconnectingsubstrate(PCB ,ceramic).Thisapplicationreportpresentsu serswithintroductoryinformationaboutatta chingQFN/SONdevicestoprintedcircuitboard s(PCBs). (PCB) (HotGasConvectionandManual).. (MSL)..43 June2002 RevisedSeptember2007 June2002 STRUCTURE AND STITCH BONDST exasInstrumentsQuadFlatpackNoLeadsandSma ll-OutlineNoLeadsQuadflatnoleads(QFNs)an dsmall-outlinenoleads(SONs) ,numberofterminations, [printedcircuitboards(PCB),ceramic].Thes tandardQFN/SONpackagehasanexposedpadthat enhancesthethermalandelectricalcharacter istics, : June2002 RevisedSeptember2007 Box/Reel LabelsEE44 CustomerAssembly Site & Assembly Date Code (YYWW)JEDEC Pb-Free Logo & Finish CodeOrdered PNHigh-Temp& Low-TempMSL ,flat,plated, (morethan50percent) (fiducials) ,PCBthickness,andpeakreflowtemperatureac cordingtothemoisturesensitivitylevel(MSL )ofcomponents,componentdensity, ( ).
www.ti.com 2 Manufacturing Considerations 2.1 SMT Process MSL Caution Label Inner Box/Reel Labels Customer E4 Assembly Site & Assembly Date Code (YYWW) JEDEC Pb-Free Logo & Finish Code
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