Transcription of Semiconductor Packing Methodology (Rev. C)
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Semiconductor Packing Methodology (Rev. C)
Application ReportSZZA021C September 20051 Semiconductor Packing MethodologyCles Troxtell, Bobby O Donley, Ray Purdom, and Edgar ZunigaStandard Linear & LogicABSTRACTThe Texas Instruments Semiconductor Group uses three Packing methodologies to preparesemiconductor devices for shipment to end users. The methods employed are linked to thedevice level for shipping configuration keys. End users of the devices often need to perusemany TI and industry publications to understand the shipping configurations. This applicationreport documents TI s three main shipping methods and typical dimensions for end users .. Background3.. Typical Applications of Each Packing Method5.. Stick Magazine (Shipping Tube) Primary Component Container5.. Tray Primary Component Container8.. Tape and Reel Primary Component Container10.. Moisture Sensitivity20.. Testing for Moisture Sensitivity20.. Dry- Packing Process21.. Dry Packing21.. Typical Packing Method21.. Conclusion26.
SZZA021C 4 Semiconductor Packing Methodology • Tape and reel − The tape-and-reel configuration is used for transport and storage from the manufacturer of the electronic components to the customer, and for use in the customer manufacturing plant.
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