Transcription of Semiconductor Packing Methodology (Rev. C)
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Semiconductor Packing Methodology (Rev. C)
Application ReportSZZA021C September 20051 Semiconductor Packing MethodologyCles Troxtell, Bobby O Donley, Ray Purdom, and Edgar ZunigaStandard Linear & LogicABSTRACTThe Texas Instruments Semiconductor Group uses three Packing methodologies to preparesemiconductor devices for shipment to end users. The methods employed are linked to thedevice level for shipping configuration keys. End users of the devices often need to perusemany TI and industry publications to understand the shipping configurations. This applicationreport documents TI s three main shipping methods and typical dimensions for end users .. Background3.. Typical Applications of Each Packing Method5.. Stick Magazine (Shipping Tube) Primary Component Container5.. Tray Primary Component Container8.. Tape and Reel Primary Component Container10.. Moisture Sensitivity20.. Testing for Moisture Sensitivity20.. Dry- Packing Process21.
Application Report SZZA021C − September 2005 1 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear & Logic
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