Transcription of Surface Mount Package Removal Application Note …
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Surface Mount Package Removal Application Note …
ApplicationReportSLVA439A September2010 ,CentralReliabilityABSTRACTT hisapplicationnotewillprovideguidelinesf orhowtoremovea SurfaceMount(SMT)packagefromaPrintedCirc uitBoard(PCB) temperatureofa SMTpackagetodesolderingtemperatureswhile thepackageis , willmasktherootcauseofa packageorSiliconchipfailure;therefore, (SnPb) (NanoStar ) (NanoStar ) (NanoFree ) (NanoFree ) September2010 RevisedDecember2010 SurfaceMountPackageRemovalApplicationNot eSubmitDocumentationFeedback 2010, ,SMTcomponentsrequirea numberoftoolscanremovecomponents, ,a keyissuein usinghot-airmachinesis is recommendedtoinitiallycoverthecomponents ,adjacenttothecomponentintendedforremova l, ,usedduringthisprocess, heatedfromthetopsidewithhotgas,whileresi dualheatis complete,thenozzlevacuumcupis automaticallyactivatedandthecomponentis designedtodisengageif used,allofthecontrollingdesoldering/sold eringvariablesshouldbestudied,includingt henumberoftimesa componentcanberemoved,replaced(onlyoncei s recommendedforTISMT components)
Application Report SLVA439A– September 2010– Revised December 2010 Surface Mount Package Removal Application Note Colin Martin..... SC …
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