Surface Mount Package Removal Application Note …

1 ApplicationReportSLVA439A September2010 ,CentralReliabilityABSTRACTT hisapplicationnotewillprovideguidelinesf orhowtoremovea SurfaceMount(SMT)packagefromaPrintedCirc uitBoard(PCB) temperatureofa SMTpackagetodesolderingtemperatureswhile thepackageis , willmasktherootcauseofa packageorSiliconchipfailure;therefore, (SnPb) (NanoStar ) (NanoStar ) (NanoFree ) (NanoFree ) September2010 RevisedDecember2010 SurfaceMountPackageRemovalApplicationNot eSubmitDocumentationFeedback 2010, ,SMTcomponentsrequirea numberoftoolscanremovecomponents, ,a keyissuein usinghot-airmachinesis is recommendedtoinitiallycoverthecomponents ,adjacenttothecomponentintendedforremova l, ,usedduringthisprocess, heatedfromthetopsidewithhotgas,whileresi dualheatis complete,thenozzlevacuumcupis automaticallyactivatedandthecomponentis designedtodisengageif used,allofthecontrollingdesoldering/sold eringvariablesshouldbestudied,includingt henumberoftimesa componentcanberemoved,replaced(onlyoncei s recommendedforTISMT components)

2 , is alsohelpfultopreheattheboardassemblyto90 C , , is stronglyrecommendedtobakethePCBsanddevic espriortoanyrework,especiallyif theSMTdeviceremovedis ,therecommendedbakeconditionsforSMTpacka gesare8 to24hoursat105 C 125 C, doneona newICpackageforthefirsttime,it is listsgenericguidelinestoremoveSMTpackage sassembledona ( ) is is importantbecausedelamination,causedbythe reworkprocess,canmaskthetruerootcauseoft hefailure.(Seeanexamplein Section5.)2 SurfaceMountPackageRemovalApplicationNot eSLVA439A September2010 RevisedDecember2010 SubmitDocumentationFeedback 2010, :Thisis onlyanexample,theexactprocedurewilldepen dontheequipmentused,itscapabilities,theP CBthermalmass, s NanoStar andNanoFree ( )overdeviceoruseequipmentsupplierrecomme ndation Caremustbetakentopreventovertravelofthev acuumtip, ,nozzlewarmingup20%airflow,125 ,225 C,90seconds(theairflowmaybedependantonpa ckagevolume)

3 ,335 C, ,370 C, ,lowervacuumnozzle, ,25 C, is removed5 ExampleofComponentDelaminationafterRemov alfromPCBC-SAMdelaminationatmountpadands everalleadsPin16/ Pin15broken/fracturedbondstitchesC-SAMis September2010 RevisedDecember2010 SurfaceMountPackageRemovalApplicationNot eSubmitDocumentationFeedback 2010,TexasInstrumentsIncorporatedExample ofa ,leadtopside, September2010 RevisedDecember2010 SubmitDocumentationFeedback 2010, 'sliquidustemperature,thepackagepickeris movedovertheICpackagetoremoveit September2010 RevisedDecember2010 SurfaceMountPackageRemovalApplicationNot eSubmitDocumentationFeedback 2010,TexasInstrumentsIncorporatedExample ofa September2010 RevisedDecember2010 SubmitDocumentationFeedback 2010,TexasInstrumentsIncorporatedApplica tionReportSLVA439A September2010 RevisedDecember2010 ReworkProcedureforTexasInstrument s NanoStar andNanoFree Packages1 NanoStar (SnPb)ReworkProcedurePresentedherearegen ericguidelinestoRemoveNanoStar (SnPbbumps) is is SetPoints onthereworkequipmentsoresultsandsettings mayvaryduetoequipmentanddifferencesin thermocoupletoensurethepeaktemperatureat boththeboardandcomponentdoesnotexceedthe MSL(MoistureSensitivityRating)ratingwhic his typically260 C forleadfreereworkis (NanoStar ) " overdevice.

4 C,nozzlewarmingup20%airflow,100 20%airflow,200 C, 20%airflow,300 C, 25%airflow,325 C, ,lowervacuumnozzle, 40%airflow,25 C, ,orroughhandlingcandamagethepartandrende rit (NanoStar ) " C,nozzlewarmingup20%airflow,100 20%airflow,200 C, 20%airflow,300 C, 25%airflow,325 C, 40%airflow,25 C,30seconds7 SLVA439A September2010 RevisedDecember2010 SurfaceMountPackageRemovalApplicationNot eSubmitDocumentationFeedback 2010,TexasInstrumentsIncorporatedNanoSta r (SnPb) (NanoFree ) " overdevice. C,nozzlewarmingup20%airflow,125 20%airflow,225 C, 20%airflow,335 C, 25%airflow,370 C, ,lowervacuumnozzle, 40%airflow,25 C, ,orroughhandlingcandamagethepartandrende rit (NanoFree ) " C,nozzlewarmingup20%airflow,125 20%airflow,225 C, 20%airflow,335 C, 25%airflow,370 C, 40%airflow,25 C,50seconds8 SurfaceMountPackageRemovalApplicationNot eSLVA439A September2010 RevisedDecember2010 SubmitDocumentationFeedback 2010, ( )hasestablishedNanoStar reflowprofilesfortheirHotGas(convection) reworkequipment,DRS-24NC, (convection)reworkequipmentandtoolingtha tis comparable.

5 NMX090 DVG/DMX090 DVG " ExhaustOpening VTMX020-35 VacuumTip NMX188 DVG '' ExhaustOpening VTMX020-35 VacuumTipHotGasConvectionNozzleRecommend edNozzleSizes(1)PackageMinXMaxXMinYMaxYN ozzleMXMYD esignator(mm)(mm)(mm)(mm) (1)AllUnitsin mm9 SLVA439A September2010 RevisedDecember2010 SurfaceMountPackageRemovalApplicationNot eSubmitDocumentationFeedback 2010,TexasInstrumentsIncorporatedIMPORTA NT NOTICET exas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers shouldobtain the latest relevant information before placing orders and should verify that such information is current and complete. All products aresold subject to TI s terms and conditions of sale supplied at the time of order warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI s standardwarranty.

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