Transcription of Wet Etching - UWEE
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Wet Etching - UWEE
EE-527: MicroFabrication Wet Etching R. B. Darling / EE-527 / Winter 2013. Outline General features of wet chemical Etching Isotropic Si Etching Anisotropic Si Etching Anisotropic GaAs Etching Isotropic Etching of SiO2, Al, and Cr Selective Etching and etch stops Special Etching techniques Electrically biased Etching Contact and via etches Pad etches Defect delineation etches Etching of probe tips R. B. Darling / EE-527 / Winter 2013. Etch Uniformity and Roughness The uniformity of an etch gives a bound on how level a surface it will produce after starting from an initially flat surface. Uniformity is a long-scale measure of surface height variation. The roughness of an etch gives a bound on how flat a surface it will produce after starting from an initially flat surface.
• Example: For 10:1 BOE etching a Si wafer surface that contains SiO 2, aluminum metalization, and Si 3 N 4 spacers: – 10:1 BOE SEL for SiO 2 / aluminum = ~ 15:1 – 10:1 BOE SEL for SiO 2 / Si 3 N 4 = ~100:1 – 10:1 BOE SEL for SiO 2 / Si substrate = > 10,000 : 1 • Selectivity is usually dependent upon etch formulation, concentration,
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