Example: dental hygienist
Ball Grid Array (BGA) Packaging - Intel

Ball Grid Array (BGA) Packaging - Intel

Back to document page

ditional power and/or ground planes to improve electrical and thermal performance. The die and bonds are protected and encapsulated with molding compound. Via holes drilled through the sub-strate provide routing from the lead fingers to the respective eutectic …

  Intel, Dilation

Download Ball Grid Array (BGA) Packaging - Intel


Information

Domain:

Source:

Link to this page:

Please notify us if you found a problem with this document:

Other abuse

Advertisement

Related search queries