JEDEC STANDARD - Designer’s Guide
J-STD-020, Joint IPC/JEDEC Standard, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface-Mount Devices. JP-001, Foundry Process Qualification Guidelines (Wafer Fabrication Manufacturing Sites). JESD22 Series, Reliability Test Methods for Packaged Devices
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ferroxcube.home.plThe purpose of this standard is to identify the classification level of nonhermetic solid state surface mount devices (SMDs) that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations.
JEDEC STANDARD - web.cecs.pdx.edu
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EIA/JEDEC STANDARD
www.navsea.navy.mil(c) Infrared (IR)/Convection solder reflow equipment capable of maintaining the reflow profiles required by this standard. It is recommended that this equipment use the IR to heat the air and not directly impinge upon the components under test. NOTE — The moisture sensitivity classification test results are dependent upon the package