Land Grid Array (LGA) Socket and Package Technology
37.5 x 37.5-mm package • Stepped Integrated Heat Sink (IHS) for socket Load Plate interface • Land Grid Array (no pins, exposed land pads), gold pads • Notched substrate for orientation control • Shipping Media: Thermoformed trays • Land Side Cover (LSC) to protect LGA package land pads from scratches and contamination when handled ...
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