Laser Application - Disco Corporation
Laser Application Ablation Process DAL7020 DFL7020 DFL7161 DFL7160 Stealth Dicing DFL7341 DFL7360FH DFL7361 Laser Lift Off DFL7560L
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Fully Automatic In-Feed Surface Grinder …
www.disco.co.jpFully Automatic In-Feed Surface Grinder DFG8540/8560 Specifications Safe wafer handling with the thin wafer robot pick Environmental conditions • Use clean, oil-free air at a dew point of -15 ℃or less.
VT07/12SERIES - disco.co.jp
www.disco.co.jpwww.disco.co.jp Vitrified Bond Blades VT07/12SERIES 仕様 2014.11 砥粒種類 SD B ボンド VC100 VC200 集中度 50 75 100 125 150 特殊仕様 外径 厚さ A1 ±0.002
Resin Bond Blades R07sERIES - disco.co.jp
www.disco.co.jpBB101 Current BB101 Current Resin Bond Blades R07SERIES 仕様 2014.12 実験データ Workpiece Blade Spindle revolution Feed speed Size ：Borosilicate glass 0.7 mmt
Electroformed Bond Hub Blades ZH05SERIES - …
www.disco.co.jpwww.disco.co.jp θ θ θ θ θ θ Electroformed Bond Hub Blades ZH05SERIES 仕様 2014.11 ZH05 -SD 2000 -N1 -110 -A**** D D ×60 E 砥粒種類 SD 1500 #1500
Fully automatic processing of thin wafers - DISCO …
www.disco.co.jpwww.disco.co.jp DFM2700 DFM2700 Operation flow [1] Workpiece reception from the grinder or the cassette loaded at [1]‘. [2] Workpiece transfer to …
Laser Application - DISCO Corporation
www.disco.co.jpLaser Application Ablation Process DAL7020 DFL7020 DFL7161 DFL7160 Stealth Dicing DFL7341 DFL7360FH DFL7361 Laser Lift Off DFL7560L
Standard dual spindle dicing saw - DISCO Corporation
www.disco.co.jpMaximized throughput The DFD63400 features a facing dual-spindle configuration with a shorter distance between blades, which improves throughput by up to
Automatic Dicing Saw DAD3350 - disco.co.jp
www.disco.co.jpAutomatic Dicing Saw DAD3350 仕様 ご使用条件 •大気圧露点-10～-20 ℃、残留油分0.1 ppm、濾過度0.01 μm/99.5％以上のクリーンな空気を使用してください。
Kezuru - DISCO
www.disco.co.jpKiru Kezuru Migaku Blade Dicing Saw Single spindle layout Single Two spindles mounted in parallel to facilitate a wide range of applications. Parallel dual Facing dual Two spindles opposite to each other along the same axis. Minimizes the cut strokes required and raises throughput. Kiru Spindle layout Cassette and tape frame High precision ...
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