Microelectronics Reliability: Physics-of-Failure Based ...
medical, military, and even telecommunications applications, it was reasonable to assume that all devices would have constant and relatively low failure rates throughout the life of the system; this assumption was built into the design, as well as reliability and safety analysis processes.
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Photonic Integrated Circuit (PIC) Device Structures ...
nepp.nasa.govand construct electronic devices onto a single CMOS chip. Photonic integrated circuits (PICs) exist as the optical analog to integrated circuits; however, in place of transistors, PICs consist of numerous scaled
Assessing and Mitigating Radiation Effects in Xilinx FPGAs
nepp.nasa.govThis research was carried out at the Jet Propulsion Laboratory, California Institute of Technology, and was sponsored by the National Aeronautics and Space Administration Electronic Parts and Packaging (NEPP) Program.
Radiation Effects Assessment of MRAM Devices - NASA
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S-311-S-819 - Resistor, Fixed, Foil (Managanin) Power ...
nepp.nasa.govSurface Mount CODE 311 SUPERVISORY APPROV~: I I I Ronald Chinnapongse ~~ Ir~7 ... fOil, precIsion, current sensing resistor In a surface mounted package. This 4-terminal (two power J-shaped and two sense gull-wing-shaped) resistor is intended for use in ... Marking shall in no way interfere with or obscure any of the original manufacturer's ...
S-311-S-821 - Resistor, Fixed, Foil (Manganin), Chip ...
nepp.nasa.govfOil, precIsion, current sensing resistor In a surface mounted package. This chip ... Marking shall in no way interfere with or obscure any of the original manufacturer's marking. b. The number of lines shall be at discretion of the test facility or laboratory. ... Foil (Manganin), Chip, Power, Current Sensing, Surface Mount ...
Mechanical Properties and Microstructure Investigation Of ...
nepp.nasa.govSn-Ag-Cu alloy is considered the preferred substitute for tin-lead solder in reflow applications due to its relatively low melting temperature, and superior mechanical properties and solderability compared with other lead free solders.
32 IEEE TRANSACTIONS ON ELECTRONICS PACKAGING ...
nepp.nasa.govCOUREY et al.: TIN WHISKER ELECTRICAL SHORT CIRCUIT CHARACTERISTICS—PART I 33 considers the following factors: conductor spacing, lead con-tent in tin plating, process by which the tin was deposited, tin thickness, materialdirectly beneaththetin, substrate controlling
IEEE TRANSACTIONS ON ELECTRONICS PACKAGING …
nepp.nasa.govCOUREY et al.: TIN WHISKER ELECTRICAL SHORT CIRCUIT CHARACTERISTICS—PART II 43 Fig. 4. Schematic diagram for the tin whisker test station instrumentation. Re-produced from [4]. Fig. 5. Tin whisker test station probing area close up.
Temperature Dependent Dielectric Properties of ...
nepp.nasa.govTemperature Dependent Dielectric Properties of Polycrystalline 96%Al 2O 3 Liang-Yu Chen1 and Gary W. Hunter2 1Ohio Aerospace Institute/NASA Glenn Research Center at Lewis Field, Cleveland, OH 44135 2NASA Glenn Research Center at Lewis Field, Cleveland, OH 44135 Abstract Polycrystalline Al 2O 3 substrates have been proposed and tested for high ...
Space Grade Requirements for Electrical Connectors
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