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QFN Layout Guidelines - TI.com

QFN Layout Guidelines - TI.com

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www .ti.com 2.1.2 Thermal Vias Thermal Via Web or Spoke Via NOT Recommended Solid Via Recommended Exposed Copper! 0,05 mm Around Via Board Layout Inner or bottom layer copper planes also can be connected to thermal pad using vias and should be made

  Guidelines, Thermal, Layout, Qfn layout guidelines

Download QFN Layout Guidelines - TI.com


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