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SMT Board Assembly Process Guide - Intel

SMT Board Assembly Process Guide - Intel

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defects. For example, in the BGA world, the thinning of substrates and overall package thickness has led to increased package warpage during the SMT process, and hence the need to adjust stencil openings. In some cases the package may tend to bend away from the PCB during SMT reflow leading to an open, and by increasing paste volume

  Intel, During, Increasing, Defects, By increasing

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