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SMT Board Assembly Process Guide - Intel

SMT Board Assembly Process Guide - Intel

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There is no one best reflow profile for all board assemblies. Ideally, a reflow profile must be characterized for each board assembly using thermocouples at multiple locations on and around the device. The solder paste type, component and board thermal sensitivity must be considered in reflow profile development. Pb-free Reflow Soldering

  Intel, Component, Board

Download SMT Board Assembly Process Guide - Intel


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