SMT Board Assembly Process Guide - Intel

1 SMT Board Assembly Process Recommendations Intel Manufacturing Enabling Guide March 2016. Intel Manufacturing Enabling Guide March 2016. SMT Board Assembly Process Disclaimers INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH Intel . PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN Intel 'S TERMS AND CONDITIONS OF SALE FOR SUCH. PRODUCTS, Intel ASSUMES NO LIABILITY WHATSOEVER AND Intel DISCLAIMS. ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF Intel .

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6 Check with your system manufacturer or retailer or learn more at [ ]. No computer system can be absolutely secure. Intel , the Intel logo, Intel Core are trademarks of Intel Corporation in the and/or other countries. *Other names and brands may be claimed as the property of others. 2016 Intel Corporation Intel Manufacturing Enabling Guide 2. March 2016. SMT Board Assembly Process Table of Contents 5. Solder Paste Printing ..5. component Reflow Soldering ..6. Pb-free Reflow Soldering .. 6. Reflow Profile Development Considerations.

7 7. Sample Reflow Parameters .. 12. Sample Reflow Profiles .. 14. 16. Rework Profile Board Preparation .. 16. Pad Cleanup After component Removal .. 18. Paste Printing Methods at Rework .. 18. Re-balling BGA's Not Recommended .. 20. Sample Rework 21. Rework Profile Development .. 22. Sample Rework Profiles .. 24. Revision Summary .. 25. Figures Figure 2-1 Reflow Profiling TC Location Example (BGA or Socket) ..8. Figure 2-2 SMT Joint Temperature TC Placement Example ..8. Figure 2-3 Sample Reflow Parameters .. 14. Figure 2-4 Sample Desktop Reflow 14.

8 Figure 2-5 Sample Mobile Reflow Profile .. 15. Figure 2-6 Sample Server Reflow Profile .. 15. Figure 2-7 Rework Profiling TC Location Example (BGA or Socket) .. 16. Figure 2-8 Sample Rework 22. Figure 2-9 Sample Rework Profile Development .. 23. Figure 2-10 Sample BGA Rework Profile .. 24. Figure 2-11 Sample Socket Rework Profile .. 24. Intel Manufacturing Enabling Guide 3. March 2016. SMT Board Assembly Process Tables Table 2-1 Sample Reflow Parameters .. 12. Table 2-2 Sample Rework Parameters .. 21. Intel Manufacturing Enabling Guide 4.

9 March 2016. SMT Board Assembly Process Introduction This chapter addresses the surface mount technology (SMT) Board Assembly Process for reflow soldering SMT components to boards, as well as rework soldering for removing and replacing individual components on already-assembled boards. The information in this document is for reference only. Manufacturing processes are unique, and may require unique solutions to ensure acceptable levels of quality, reliability, and manufacturing yield. Due to differences in equipment and materials, customer-specific Process parameter development and validation is required.

10 Solder Paste Printing Although there are a number of lead free (Pb-free) alloys, the most commonly used compositions contain tin, silver, and copper, commonly expressed as SAC, for SnAgCu. Within SAC solders, by far the most common usage is Sn/3 , a near-eutectic which melts between 217 C and 220 C. Stencil aperture sizes can be 1:1 with pad size, but certain parts may require reduced or increased stencil apertures to reduce solder ball defects. For example, in the BGA world, the thinning of substrates and overall package thickness has led to increased package warpage during the SMT Process , and hence the need to adjust stencil openings.