TEST METHOD STANDARD ELECTRONIC AND ELECTRICAL …
Within each class, test methods are serially numbered in the order in which they are introduced into this standard. 1.2.2 Revision of test methods. Revisions of test methods are indicated by a letter following the method number. For example, the original number assigned to the moisture resistance test method is 106; the first revision of that
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Photonic Integrated Circuit (PIC) Device Structures ...
nepp.nasa.govand construct electronic devices onto a single CMOS chip. Photonic integrated circuits (PICs) exist as the optical analog to integrated circuits; however, in place of transistors, PICs consist of numerous scaled
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Radiation Effects Assessment of MRAM Devices - NASA
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S-311-S-819 - Resistor, Fixed, Foil (Managanin) Power ...
nepp.nasa.govSurface Mount CODE 311 SUPERVISORY APPROV~: I I I Ronald Chinnapongse ~~ Ir~7 ... fOil, precIsion, current sensing resistor In a surface mounted package. This 4-terminal (two power J-shaped and two sense gull-wing-shaped) resistor is intended for use in ... Marking shall in no way interfere with or obscure any of the original manufacturer's ...
S-311-S-821 - Resistor, Fixed, Foil (Manganin), Chip ...
nepp.nasa.govfOil, precIsion, current sensing resistor In a surface mounted package. This chip ... Marking shall in no way interfere with or obscure any of the original manufacturer's marking. b. The number of lines shall be at discretion of the test facility or laboratory. ... Foil (Manganin), Chip, Power, Current Sensing, Surface Mount ...
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32 IEEE TRANSACTIONS ON ELECTRONICS PACKAGING ...
nepp.nasa.govCOUREY et al.: TIN WHISKER ELECTRICAL SHORT CIRCUIT CHARACTERISTICS—PART I 33 considers the following factors: conductor spacing, lead con-tent in tin plating, process by which the tin was deposited, tin thickness, materialdirectly beneaththetin, substrate controlling
IEEE TRANSACTIONS ON ELECTRONICS PACKAGING …
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Space Grade Requirements for Electrical Connectors
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