Xilinx UG112 Device Package User Guide
Device Package User Guide www.xilinx.com UG112 (v3.7) September 5, 2012 03/17/09 3.2 Revised “Small Form Factor Packages,” page 15 to include description of third template used for marking small form factor packages. Revised “Package Construction,” page 20 to describe flip-chip package vent hole locations.
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