Search results with tag "Thermosonic"
Automotive Electronics Council
aecouncil.comusing a thermal compression or thermosonic wire bonding process. The ball bond includes the enlarged spherical portion of the wire (sometimes referred to as the nail head and formed by the flame-off and first bonding operation in thermal compression and thermosonic process), the underlying bonding surface, and the intermetallic weld interface.
HMC247 - Analog Devices
www.analog.comThermosonic wirebonding with a nominal stage temperature of 150 deg. C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or
Gold & Aluminum Bonding Wedges Bonding Spectrum
www.smallprecisiontools.comwire. The principle difference between the two processes is that the aluminum wire is bonded in an ultrasonic bonding process at room temperature, whereas gold wire wedge bonding is performed through a thermosonic bonding process with heat up to 175°C. A considerable advantage of the
Effect of gas type and flow rate on Cu free air ball ...
uwaterloo.caEffect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding A. Pequegnata,*, H.J. Kima, M. Mayera, Y. Zhoua, J. Persicb, J.T. Moonc a ...